Multi-material structural adhesive, heat or room temperature curing.
Epoxy glue is a structural glue mainly intended for industrial assembly and multi-material assemblies. Thanks to its strong adhesive power, epoxy adhesive offers a superior mechanical resistance to industrial assemblies. Thus, it meets the increasingly demanding bonding applications of high-tech industries.
Epoxy adhesives are available in one-component and two-component bases. In the first case, the reactive resin cures at high temperatures, while the two-component resin cures at room temperature. The epoxy adhesive offers a real alternative to the traditional assembly processes: riveting, welding and stirring.
These different types of epoxy resins are used in particular in the production of smart cards and RFID labels as well as for bulky or heat-sensitive components.
| Reference | Color | Viscosity(mPa.s) | HardnessShore | Elongation(%) | TensileStrengh(MPa) | Technicaldatasheet |
|---|---|---|---|---|---|---|
| 4031 | Silver | 9 000 | - | - | - | |
| PARBOND 5615 | - | 50 000 | 75D | - | 16 |
| Reference | Color | Viscosity(mPa.s) | HardnessShore | Elongation(%) | TensileStrengh(MPa) | Technicaldatasheet |
|---|---|---|---|---|---|---|
| 4012 | Argent | Pasty | 70D | - | - | |
| 2711 | Transparent / orange | 500 | 45D | 72 | 1,2 | |
| 671 | Black | P | 80D | - | 14,5 | |
| 6236 | Black | 19 000 | 85D | - | 16 |
Impact resistance
Strong elongation
1 component
Chemical resistance
Flexible adhesive
2 components
Thermal resistance
